Header having high-density conductor arrangement and method of making same

ABSTRACT

A header having a high-density density conductor arrangement having a plurality of equally spaced-apart conductors held in place by a sealing, electrical insulating material. A method of forming such a header with a high-density conductor arrangement by chemically milling or stamping the conductors from a single sheet of material, leaving them joined by strips at both ends. The conductors are formed in the shape desired and fused to a base, after which the upper strip is ground off and the conductors are plated. The conductors are now ready for use in the final manufacture of electronic assemblies such as transistors, integrated circuits, etc.

United States Patent Williams 51 Jan. 18, 1972 HEADER HAVINGHIGH-DENSITY CONDUCTOR ARRANGEMENT AND METHOD OF MAKING SAME Neal T.Williams, Bloomfield, NJ.

Sealtronics, lnc., Clifton, NJ.

June 11, 1970 Inventor:

Assignee:

Filed:

Appl. No.1

US. Cl ..l74/50-56, 29/ 193, 29/589, 29/624, 174/50.6l, l74/50.64,l74/DIG. 3, 65/59 Int. Cl. ....H0lj 5/40, H05k 5/06 Field of Search.....l74/50.S650.58, 174/1524, 50.6, 50.61, 50.63, 52 S, DIG. 3, 50.52,50.54, 50.64; 29/630, 588-590, 472.9, 624; 65/59 References Cited UNITEDSTATES PATENTS l ome rson S I I i E 3,529,073 9/1970 Leonard ..l74/52SPrimary Examiner-Darrell L. Clay Attorney-Samuelson & Jacob [57]ABSTRACT A header having a highdensity density conductor arrangementhaving a plurality of equally spaced'apart conductors held in place byasealing, electrical insulating material.

A method of forming such a header with a high-density conductorarrangement by chemically milling or stamping the conductors from asingle sheet of material, leaving them joined by strips at both ends.The conductors are formed in the shape desired and fused to a base,after which the upper strip is ground off and the conductors are plated.The conductors are now ready for use in the final manufacture ofelectronic assemblies such as transistors, integrated circuits, etc.

10 Claims, 13 Drawing Figures PATENTED mu 81972 3; 636, 235

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ICIEIIJIZICIDDIZICIJILIJIZI immmcammmm INVENTOR Nam. T Wmuams HEADERHAVING HIGH-DENSITY CONDUCTOR ARRANGEMENT AND METHOD OF MAKING SAME Theinvention relates to headers having high-density conductor arrangementsfor use in providing connecting leads for electronic assemblies such astransistors, integrated circuits, microelectronic circuits and the like.In particular, the invention is directed toward providing more preciseassembly and higher conductor packing densities than have beenattainable heretofore.

In the prior art, the individual conductors were individually sealed inthe outer metal ring. This requires large finished sizes because theindividual conductors must be held in position during sealing by toolingwhich is subject to high temperatures, wear and initial machiningdeviations. In some prior art assemblies, the conductors are joined atone end by a connecting band. Even these assemblies are subjected topositioning inaccuracies due to the bending of the unsupported ends ofthe conductors.

Moreover, hermetic defects are generated by material handling in theassembly procedures and such handling increases in proportion with theincrease in the number of conductors. This increased handling reducesthe yield.

To obtain uniform plating of the conductors it is necessary to join themat one end. Except for the prior art assemblies, which are joined by aband at one end, it is necessary to electrically connect the individualconductors by special wiring or racks prior to and during the platingoperation.

Operator inaccuracy or machine errors result in defects whichproliferate as the number of conductors is increased. Bent conductorends, missing conductors and uneven spacing either reduce the productiveyield or make it difficult for the end user to use the finished product.

It is an important object of the invention to provide a header having ahigh-density conductor arrangement by creating precise spacing of theindividual conductors thus making highconductor packing densitiespossible.

It is a further object of the invention to provide a method for makingsuch an arrangement.

These and other objects, features, uses and advantages will be apparentduring the course of the following description when taken in conjunctionwith the accompanying drawings.

Broadly, the invention comprises chemically milling or stamping aplurality of equally spaced conductors from a single sheet, leaving bothends of the conductors joined by conductive strips. The desired numberof conductors are severed from the sheet and they are formed into thedesired configuration. One end of the conductors is placed in a sealingjig with the strip elevated from the seal area so that the strip remainsfree when the combination is hermetically sealed. This effectivelypositions the conductors in the proper relationship. The end stripnearest the hermetic sealing is ground off and the conductor ends areground to the desired height above the seal.

The combination is then plated in a plating solution (such as gold forsemiconductor use). The plating procedure is uniform because theconductors are all connected by the remaining strip or band which alsohelps to protect the conductors from damage. Now, the electroniccomponents are installed and connected to the individual pins. Whenassembly .is completed, the lower band is removed so that the individualconductors are available for connection in the external electronicsystem.

It is also within the contemplation of the invention to surround theconductois with an internal or external insulating ring or a combinationof both to form a plug to thereby permit the unit to be readily insertedinto and removed from a mating receptacle. Moreover, a plurality ofconductive sheets may be used and various shapes and configurations ofthe finished units may be produced utilizing the teaching oftheinvention.

In the accompanying drawings, forming a part of this application, and inwhich like numerals are employed to designate like parts throughout thesame:

FIG. I is a plan view of an embodiment of the invention;

FIG. 2 is a sectional view, taken on lines 2-2 of FIG. I, viewed in thedirection of the arrows;

FIG. 3 is an elevational view of a typical, chemically milled or stampedsheet used in carrying out the teachings of the invention:

FIG. 4, on the same sheet as FIGS. 1 and 2, is an exploded view showingthe parts used in making the embodiment of FIGS. 1 and 2;

FIG. 5 is an elevational view of an alternative mounting base which maybe used with the embodiment of FIGS. 1 and 2;

FIG. 6 is a view similar to that of FIG. I of a further embodiment ofthe invention;

FIG. 7 is a sectional view, taken on the lines 7-7 of FIG. 6, viewed inthe direction of the arrows;

FIG. 8 is a view similar to that of FIG. 4 of the embodiment of FIGS. 6and 7;

FIG. 9 is a view similar to that of FIG. I of a two-row embodiment ofthe invention;

FIG. 10 is a view similar to that of FIG. 6 of a two-row embodiment ofthe invention;

FIG. 11 is a view similar to that of FIG. 2, but inverted, showing theuse of an insulating ring inside the conductors to form a plug-in-typeunit;

FIG. 12 is a view similar to that of FIG. 1 1, showing the use of aninsulating ring outside the conductors to form a plug-intype unit; and

FIG. 13 is a view similar to that of FIG. 11, showing the use of twoinsulating rings, one inside and one outside the conductors, to form aplug-in-type unit.

In the drawings, wherein, for the purpose of illustration, are shownvarious embodiments of the invention, the numeral 20 designates anembodiment of conductor arrangement of the invention for use as anelectronic component header. Header 20 is seen to comprise (FIGS. 1 and2) an outer metallic ring 22 and a plurality of conductive pins 24joined at one extremity by strip or band 26 and sealed within the ring22 by hermetic seal 28 of glass or other sealing material with theconductor ends 25 projecting above the seal.

Header 20 is formed by chemically milling or stamping a sheet ofconductive material 30 so as to form a plurality of individualconductors 24joined at both ends by strips 26 and 32 (FIG. 3). Therequired number of conductors are cut from the sheet and are formed intothe desired configuration (FIG. 4). Assembly proceeds by placing theupper end of the conductive sheet 31 between glass rings 34 and 36 sothat strip 32 and a portion of the individual conductors project abovethe rings. Metallic base 38 and ring 22 are fitted inside ring 34 andoutside ring 36, respectively. Now, the heat required to cause the glassto flow and seal the conductors in place is applied.

For the so-called matched seal technology, the conductors, the metallicbase and the ring are typically iron-nickelcobalt alloys such as Kovarand the sealing material is Coming 7052 glass. For the so-calledcompression seal technique, the conductors, and the metallic base areformed of nickel iron alloy such as No. 52 alloy, the outer ring istypically formed of cold rolled steel and the sealing material is Coming9010 glass. It should be noted, however, that any other sealingmaterial, which is capable of flow, may also be used. This would includeplastic, epoxy molding, Mycalex and similar material.

After the combination is assembled, and the conductors are sealed inplace, the upper strip 32 is ground off, leaving the ends 25 projectingabove the seal. In the same operation, the ends 25 may be ground touniform height. Next, the assembly is placed in the plating bathand theconductors are plated. Because one of the plating connections is made tostrip 26, the plating on the conductors is very uniform. The combinationis now ready for internal wiring. The desired electrical circuits arewired to the conductor ends 25 and the strip 26 is removed by cuttingthe conductors 24 above the upper edge of the strip. This effectivelyfrees and separates the conductors 24,

'making the finished assembly ready for use.

If desired, base 40 with stud 42 (FIG. 5) may be substituted for base38. It is noted that whichever base is used, only five parts must behandled in the production of the header 20 of the invention.

FIGS. 6-8 illustrate a further embodiment of a square header 44 in whichonly eight parts are handled. Header 44 is formed of four sheets 31 ofconductors 24 having upper strips 32 and lower strips 26, base 46,sealing rings 48 and 50 and outer ring 52. The combination is assembledas described earlier and the strips 31 are sealed as shown at 54. Thenthe upper strips 32 are removed and the ends 25 are ground to thecorrect height. The leads may now be plated as described earlier.Following which, the electronic components are connected to the leadends 25 and the lower strip 26 is removed.

The embodiment of FIG. 9 is assembled in the same manner as that ofFIG. 1. It comprises an outer ring 56, two concentric sets of conductors24 and a base 58. Assembly and construction follows the same procedureas was described earlier. It should be noted that three, mating, sealingrings are used in order to seal the conductors in place.

The embodiment of FIG. 10 is assembled in the same manner as that ofFIG. 6. It comprises an outer ring 60, an inner base 62 and eight setsof conductors 24. Assembly and construction follows the same procedureas was described earlier. It should be noted again that three, mating,sealing rings are used in order to seal the conductors in place.

It can readily be seen that any number of concentric rings of conductorsmay be used to increase the number of conductors while occupyingrelatively little space.

The embodiments of FIGS. 11-13 utilize the teaching of the invention toproduce a plug-type header for ready insertion into and removal from amating plug. After the pins of any of the previously describedembodiments have been plated, an insulator 64 is formed inside the pinsand in contact with them. Then strip 26 is removed. Insulator 64 may bea plastic, epoxy or other material which is applied in liquid form in ajig or it may be a solid ring made of glass, ceramic, plastic, Mycalexor similar material which is bonded into place with epoxy or similarmaterial. FIG. 11 is shown inverted from FIG.

. 2 since, when solid rings are used, it is easier to put them in placewith thebottom of the assembly up. When the unit is finished and theinternal wiring is completed, it may be plugged into a receptacle'havingindividual contacts which connect to the outside of the individual pins24 of the header 20.

Ring 66 of FIG. 12 is formed of material similar to that of ring 64 ofFIG. 11. The completed header may make contact by means of the tips ofpins 24 in the usual plug-in receptacle. Alternatively, a receptacle maybe used which fits inside the header pins and whose individual contactsmake contact with the inside of the individual pins 24 of the header 20.

Rings 68 and 70 of FIG. 13 are formed of material similar to thatforming rings 64 and 66. Ring 68 is inside the pins and ring 70 isoutside the pins and contact is normally made to the protruding tips ofpins 24. However, special sockets may be used which will permit contactto be made to the inside and/or the outside of the pins.

It is also within the contemplation of the invention to substitute adisc for either ring 64 or ring 68.

While particular embodiments of the invention have been shown anddescribed, it is apparent to those skilled in the artthat modificationsarepossible without departing from the spirit of the invention or thescope of the subjoined claims.

The embodiments of the invention in which an exclusive property orprivilege is claimed are defined as follows:

I. A header having high-density conductor arrangements for electronicassemblies comprising:

a metal base whose outer perimeter is shaped in the desired shape of theheader;

a metal ring having an internal perimeter larger than that of the outerperimeter of the metal base and disposed outside the metal base;

a sheet of spaced-apart conductors disposed between the metal base andthe metal ring and substantially surrounding the metal base;

the sheet of spaced-apart conductors having a first end and a secondend;

sealing means sealing the first end of the sheet of spacedapartconductors between the metal base and the metal ring and insulating thesheet of spaced-apart conductors therefrom;

the individual ends of the conductors at the said first end projectingbeyond the sealing means for sufficient distance to permit connectionsto be made thereto;

the conductors at the said second end of the sheet of spaced-apartconductors being joined together by a single strip of the materialthereof.

2. The invention of claim 1 including:

a plurality of sheets of spaced-apart conductors, each such sheet ofspaced-apart conductors being of such size so as to conform to theperimeter of the metal base;

no two such sheets of spaced-apart conductors being of the same size;

the sheets of spaced-apart conductors being disposed one inside theother;

the sealing means sealing the plurality of sheets between the metal baseand the metal ring with the conductors of one I sheet of spaced-apartconductors being spaced from the conductors of every other sheet ofspaced-apart conductors.

3. The invention of claim 1 including an insulating ring in contact withthe individual conductors adjacent the said second end of the sheet ofspaced-apart conductors.

4. The invention of claim 3 wherein the insulating ring is internal ofthe conductors.

5. The invention of claim 3 wherein the insulating ring is external ofthe conductors.

6. The method of making a header having high-density conductorarrangements for electronic assemblies comprising:

making a conductive sheet having a plurality of spacedapart individualconductors joined at both ends by strips of the conductive sheet;

placing the conductive sheet around a metal base so that the said sheetsubstantially surrounds the metal base and so that the metal base isbetween the two said strips and close to one of them; I

placing a'metal ring opposite the metal base and surrounding theconductive sheet so that the conductive sheet is between the metal baseand the metal ring;

sealing the conductive sheet between the metal base and the metal ringto hold the conductive sheet in position such that the strip close tothe metal base is out of contact with the seal so formed and theconductive sheet is insulated from the metal base and the metal ring;

grinding off the said strip close to the metal base;

plating the conductive sheet.

7. The invention of claim 6 including:

removing the strip at the other end of the conductive sheet afterplating.

8. The invention of claim 7 including before removing the strip at theother end of the conductive sheet:

placing insulating means in contact with the plurality of conductors atthe said other end to form a plug.

9. The invention of claim 6 including prior to sealing;

making a second conductive sheet having a plurality of spaced apartindividual conductorsjoined at both ends by strips of the conductivesheet;

placing the second conductive sheet around the metal ring so that thesaid second sheet substantially surrounds the metal ring and so that themetal ring is between the two said strips and close to one of them;

placing a second metal ring opposite the metal ring and surrounding thesecond conductive sheet so that the said second sheet is between the twometal rings;

sealing the combination so that the said conductive sheet is sealedbetween the metal base and the metal ring to be held in position suchthat the strip close to the metal base is out of contact with the sealand the conductive sheet is insulated from the metal base and the metalring and so that the second conductive sheet is sealed between the metalring and the second metal ring to be held in position such that thestrip close to the metal ring is out of contact with the seal and thesecond conductive sheet is insulated

1. A header having high-density conductor arrangements for electronicassemblies comprising: a metal base whose outer perimeter is shaped inthe desired shape of the header; a metal ring having an internalperimeter larger than that of the outer perimeter of the metal base anddisposed outside the metal base; a sheet of spaced-apart conductorsdisposed between the metal base and the metal ring and substantiallysurrounding the metal base; the sheet of spaced-apart conductors havinga first end and a second end; sealing means sealing the first end of thesheet of spaced-apart conductors between the metal base and the metalring and insulating the sheet of spaced-apart conductors therefrom; theindividual ends of the conductors at the said first end projectingbeyond the sealing means for sufficient distance to permit connectionsto be made thereto; the conductors at the said second end of the sheetof spacedapart conductors being joined together by a single strip of thematerial thereof.
 2. The invention of claim 1 including: a plurality ofsheets of spaced-apart conductors, each such sheet of spaced-apartconductors being of such size so as to conform to the perimeter of themetal base; no two such sheets of spaced-apart conductors being of thesame size; the sheets of spaced-apart conductors being disposed oneinside the other; the sealing means sealing the plurality of sheetsbetween the metal base and the metal ring with the conductors of onesheet of spaced-apart conductors being spaced from the conductors ofevery other sheet of spaced-apart conductors.
 3. The invention of claim1 including an insulating ring in contact with the individual conductorsadjacent the said second end of the sheet of spaced-apart conductors. 4.The invention of claim 3 wherein the insulating ring is internal of theconductors.
 5. The invention of claim 3 wherein the insulating ring isexternal of the conductors.
 6. The method of making a header havinghigh-density conductor arrangements for electronic assembliescomprising: making a conductive sheet having a plurality of spaced-apartindividual conductors joined at both ends by strips of the conductivesheet; placing the conductive sheet around a metal base so that the saidsheet substantially surrounds the metal base and so that the metal baseis between the two said strips and close to one of them; placing a metalring opposite the metal base and surrounding the conductive sheet sothat the conductive sheet is between the metal base and the metal ring;sealing the conductive sheet between the metal base and the metal ringto hold the conductive sheet in position such that the strip close tothe metal base is out of contact with the seal so formed and theconductive sheet is insulated from the metal Base and the metal ring;grinding off the said strip close to the metal base; plating theconductive sheet.
 7. The invention of claim 6 including: removing thestrip at the other end of the conductive sheet after plating.
 8. Theinvention of claim 7 including before removing the strip at the otherend of the conductive sheet: placing insulating means in contact withthe plurality of conductors at the said other end to form a plug.
 9. Theinvention of claim 6 including prior to sealing; making a secondconductive sheet having a plurality of spaced apart individualconductors joined at both ends by strips of the conductive sheet;placing the second conductive sheet around the metal ring so that thesaid second sheet substantially surrounds the metal ring and so that themetal ring is between the two said strips and close to one of them;placing a second metal ring opposite the metal ring and surrounding thesecond conductive sheet so that the said second sheet is between the twometal rings; sealing the combination so that the said conductive sheetis sealed between the metal base and the metal ring to be held inposition such that the strip close to the metal base is out of contactwith the seal and the conductive sheet is insulated from the metal baseand the metal ring and so that the second conductive sheet is sealedbetween the metal ring and the second metal ring to be held in positionsuch that the strip close to the metal ring is out of contact with theseal and the second conductive sheet is insulated from the metal ringand the second metal ring; grinding off the strip of the secondconductive sheet close to the metal ring; plating the second conductivesheet.
 10. The invention of claim 9 including: removing the strip at theother end of the second conductive sheet after plating.